The WInSiC4AP project is one of the fi rst examples of the technical and scientific integration of two financial mechanisms, one is European (funds from the ECSEL JU programme) and the other all-Italian FESR funds from the Italian Ministry of Education and Universities: this characteristic explains how the project can count on such important funding – to cover part of the about 30 million euro of the research costs – , and the many projects partners involved – (twenty in total covering four different Countries, and coordinated by the Sicilian Micro and Nano Systems Technological District).
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In the frame of Aerospace Valley Cluster, the DAS (Stategic Activities Domain) ESE (Electronics & Embedded Equipment’s) was organized a forum on “New Power Electronics Components: Interconnections & Packaging – Innovations et Challenges”.Read More
DECIELEC Forum : Labege (France), October 18-19, 2017. Reference event for electronics, connected & embedded systems.
Participants benefited from the Business Convention unique concept:
– Business meetings dedicated to electronics, Read More