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“Silicon carbide powering sustainable mobility” published the article about the “WInSiC4AP” project in the Platinum magazine

The WInSiC4AP project is one of the fi rst examples of the technical and scientific integration of two financial  mechanisms, one is European (funds from the ECSEL JU programme) and the other all-Italian FESR funds from the Italian Ministry of Education and Universities: this characteristic explains how the project can count on such important funding – to cover part of the about 30 million euro of the research costs – , and the many projects partners involved – (twenty in total covering four different Countries, and coordinated by the Sicilian Micro and Nano Systems Technological District).   

read the full article:  Open link


EFECS 2017

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EFECS (European Forum for Electronic Components and Systems) is the international forum with a focus on ‘Our Digital Future’ along the Electronic Components and Systems value chain in Europe. The organisers of this event, AENEAS, ARTEMIS-IA, EPoSS, ECSELRead More


DECIELEC 2017 Forum

DECIELEC Forum : Labege (France), October 18-19, 2017. Reference event for electronics, connected & embedded systems.
Participants benefited from the Business Convention unique concept:
– Business meetings dedicated to electronics, Read More


This project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking (ECSEL JU) under grant agreement No.737483. This Joint Undertaking receives support from the European Union’s Horizon 2020 research and innovation programme and Czech Republic, France, Germany, Italy.

This project also receives ESI funds from MIUR 2014-2020 FESR program.