Technical innovation

The project will develop innovative end-user products (application systems and subsystems) based on SiC technology.
Advanced technology bricks:
•    Packaging, PCB, Passive Components
•    SiC and package bricks for discrete or modules mainly at 650V, 1200V till 1700V with a current range spanning from 10A to 400A.
•    Applicative platforms across different industrial domains [i.e. DC-DC converter, Inverter, other for Avionics]

This project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking (ECSEL JU) under grant agreement No.737483. This Joint Undertaking receives support from the European Union’s Horizon 2020 research and innovation programme and Czech Republic, France, Germany, Italy.

This project also receives ESI funds from MIUR 2014-2020 FESR program.