Category: Events
ECSCRM 2018 – Birmingham, September 2-6, 2018

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The European Conference on Silicon Carbide and Related Materials (ECSCRM) is a highly-anticipated event, held every two years, that represents an important international forum that brings together world-leading specialists working in different areas of silicon carbide and other wide band gap semiconductors.Read More


International Automotive Conference 2018

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On the 9th, 10th and 11th of July the International Automotive Conference 2018 was organized at the Polytechnic of Milan Bovisa Campus organized by AEIT and IMAPS, in collaboration with the Polytechnic of Milan, the Polytechnic University of Milan and the Polytechnic of Turin. ST, as a Golden Sponsor, took part in the event with various interventions.

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ECSEL SYMPOSIUM 2018

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The ECSEL Symposium 2018 was held in Brussels on June 19 & 20.
Industry, research, finance and the academic world participated together with policy makers at European, National and Regional levels.Read More


Ecsel Italy 2018

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The second edition of the ECSEL Mirror Group Italia National Day, held on 1 March 2018, was confirmed as the reference forum for the Italian participation in the calls for the joint ECSEL technology initiative and other H2020 funding programs.
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4th National Sensors Convention

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The Technology District sponsored the 4th National Sensors Convention, organized every two years by major scientific societies in Italy and hosted, for this edition, in Catania from 21 to 23 February 2018 in the prestigious headquarters of the Diocesan Museum.Read More


EFECS 2017

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EFECS (European Forum for Electronic Components and Systems) is the international forum with a focus on ‘Our Digital Future’ along the Electronic Components and Systems value chain in Europe. The organisers of this event, AENEAS, ARTEMIS-IA, EPoSS, ECSELRead More


Interconnections & Packaging Forum

In the frame of Aerospace Valley Cluster, the DAS (Stategic Activities Domain) ESE (Electronics & Embedded Equipment’s) was organized a forum on “New Power Electronics Components: Interconnections & Packaging – Innovations et Challenges”.Read More


DECIELEC 2017 Forum

DECIELEC Forum : Labege (France), October 18-19, 2017. Reference event for electronics, connected & embedded systems.
Participants benefited from the Business Convention unique concept:
– Business meetings dedicated to electronics, Read More


AIDAA International Conference

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DTSMNS represented the project as a whole (and Leoluca Liggio took a plenary speech section) at the AIDAA International Conference, in September 2017, in Palermo.
It were present also Filippo D’Arpa and prof. Costantino GiaconiaRead More


ICSCRM 2017

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The International Conference on Silicon Carbide and Related Materials is the most important technical conference series in the world for electronics devices technology based on silicon carbide (SiC) and related materials.
The ICSCRM2017 was held September 17–22, 2017,Read More


This project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking (ECSEL JU) under grant agreement No.737483. This Joint Undertaking receives support from the European Union’s Horizon 2020 research and innovation programme and Czech Republic, France, Germany, Italy.

This project also receives ESI funds from MIUR 2014-2020 FESR program.