On the 9th, 10th and 11th of July the International Automotive Conference 2018 was organized at the Polytechnic of Milan Bovisa Campus organized by AEIT and IMAPS, in collaboration with the Polytechnic of Milan, the Polytechnic University of Milan and the Polytechnic of Turin. ST, as a Golden Sponsor, took part in the event with various interventions.
The ECSEL Symposium 2018 was held in Brussels on June 19 & 20.
Industry, research, finance and the academic world participated together with policy makers at European, National and Regional levels.Read More
The second edition of the ECSEL Mirror Group Italia National Day, held on 1 March 2018, was confirmed as the reference forum for the Italian participation in the calls for the joint ECSEL technology initiative and other H2020 funding programs.
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The Technology District sponsored the 4th National Sensors Convention, organized every two years by major scientific societies in Italy and hosted, for this edition, in Catania from 21 to 23 February 2018 in the prestigious headquarters of the Diocesan Museum.Read More
EFECS (European Forum for Electronic Components and Systems) is the international forum with a focus on ‘Our Digital Future’ along the Electronic Components and Systems value chain in Europe. The organisers of this event, AENEAS, ARTEMIS-IA, EPoSS, ECSELRead More
In the frame of Aerospace Valley Cluster, the DAS (Stategic Activities Domain) ESE (Electronics & Embedded Equipment’s) was organized a forum on “New Power Electronics Components: Interconnections & Packaging – Innovations et Challenges”.Read More
DECIELEC Forum : Labege (France), October 18-19, 2017. Reference event for electronics, connected & embedded systems.
Participants benefited from the Business Convention unique concept:
– Business meetings dedicated to electronics, Read More
DTSMNS represented the project as a whole (and Leoluca Liggio took a plenary speech section) at the AIDAA International Conference, in September 2017, in Palermo.
It were present also Filippo D’Arpa and prof. Costantino GiaconiaRead More
The International Conference on Silicon Carbide and Related Materials is the most important technical conference series in the world for electronics devices technology based on silicon carbide (SiC) and related materials.
The ICSCRM2017 was held September 17–22, 2017,Read More
The WInSiC4AP project was kicked off in June 27, 2017 with the full consortium members presence. The day was focused on the project scope, work package presentations by the work package leaders, and the aim was to confirm the planning the actions.Read More